Lead-free high uniformity tin-plated copper wire/clad steel wire
Applied to high-speed, high-efficiency soldering equipment! Excellent solder wetting properties due to material uniformity and toughness.
At Daitō Japan Co., Ltd., we handle "Lead-Free High Uniformity Tin-Plated Copper Wire/Clad Steel Wire." By adopting oxygen-free dip copper wire, we leverage excellent material uniformity and toughness, resulting in superior solder wetting properties. The tin-plated surface is smooth and uniform, further enhancing the efficiency of the mounting process. It can be applied to high-speed and high-efficiency soldering equipment. 【Features】 ■ Applicable to high-speed and high-efficiency soldering equipment ■ Adopts oxygen-free dip copper wire ■ Excellent solder wetting properties ■ Strong corrosion resistance and durability ■ Solder wetting properties remain almost unchanged even after long-term storage *For more details, please refer to the PDF materials or feel free to contact us.
- Company：大同日本
- Price：Other
